Failure analysis reports often contain dense terminology, unfamiliar test methods, and highly technical conclusions. For readers without a materials science or semiconductor background, this can make it difficult to extract the most important information—or to know which findings actually matter. This guide explains how to read a failure analysis report effectively, focusing on what to …
When a component fails, the first instinct is often to question the design. While design flaws do occur, many failures originate earlier or later in the lifecycle—during manufacturing, assembly, handling, or test. Identifying process-induced failures early helps teams avoid misdirected redesign efforts and focus corrective action where it will be most effective. Recognizing these indicators …
Counterfeit electronic components remain a persistent risk in modern supply chains, particularly when parts are sourced outside authorized distribution channels. This case study describes how a suspect lot of integrated circuits (ICs) was evaluated to determine authenticity and risk before entering production. The objective was not only to identify whether the parts were counterfeit, but …
Electronic components are often evaluated based on electrical performance alone, but the materials used in packaging can provide critical insight during failure analysis and authenticity investigations. Package materials influence thermal behavior, mechanical reliability, environmental resistance, and long-term performance. Understanding these materials helps investigators interpret damage mechanisms correctly and avoid misattributing the cause of failure. Why …
Failure analysis often begins with urgency: a failed part, a missed shipment, or pressure to identify fault quickly. In that environment, it’s tempting to move directly into testing or teardown. However, starting without a defined analysis plan frequently leads to wasted samples, inconclusive results, or misleading conclusions. A well-designed failure analysis plan aligns objectives, techniques, …
When investigating a suspect integrated circuit (IC), one of the first questions engineers face is whether to begin with electrical testing or physical analysis. Choosing the wrong starting point can waste time, consume limited samples, or obscure the true failure mechanism. Understanding the strengths and limitations of each approach helps ensure the investigation produces clear, …
Cross-sectioning is a fundamental technique in electronic failure analysis used to expose and evaluate the internal construction of devices and assemblies. By physically sectioning a sample and examining its internal features, engineers can directly observe materials, interfaces, and structures that are otherwise inaccessible. Cross-sectioning plays a critical role in identifying manufacturing defects, material degradation, and …
Light-emitting diode (LED) discoloration is a common field concern in electronic assemblies, particularly in applications involving elevated temperature, humidity exposure, or long operating lifetimes. While discoloration is often perceived as a cosmetic issue, it can be indicative of underlying material degradation mechanisms that may ultimately impact optical performance or device reliability. This case study documents …
Time Domain Reflectometry (TDR) is a diagnostic technique widely used in electronic failure analysis to evaluate the integrity of conductive paths within devices and assemblies. It is particularly effective for localizing continuity-related defects such as opens, shorts, and impedance discontinuities that are difficult or impossible to detect through visual inspection alone. Because TDR is non-destructive …
Scanning Acoustic Microscopy (SAM) is a non-destructive inspection technique used extensively in electronic failure analysis to detect internal structural defects that are not visible using optical methods. By utilizing high-frequency ultrasonic waves, SAM enables engineers to image subsurface features and interfaces within electronic devices and assemblies, making it particularly valuable for identifying delamination, voids, cracking, …