Articles in this category focus on specific analytical techniques used in electronic failure analysis. Topics include non-destructive inspection methods, microscopy, electrical characterization, and targeted physical analysis. Content explains when and why particular techniques are applied, along with their capabilities and limitations within a broader investigation.
Learn what X-ray inspection can reveal in electronic failure analysis, where it falls short, and when to combine it with other analytical methods. When an electronic component or assembly fails, one of the first questions is how much can be learned without cutting into the part or otherwise altering the evidence. X-ray inspection is often …
Failure analysis reports often contain dense terminology, unfamiliar test methods, and highly technical conclusions. For readers without a materials science or semiconductor background, this can make it difficult to extract the most important information—or to know which findings actually matter. This guide explains how to read a failure analysis report effectively, focusing on what to …
When a component fails, the first instinct is often to question the design. While design flaws do occur, many failures originate earlier or later in the lifecycle—during manufacturing, assembly, handling, or test. Identifying process-induced failures early helps teams avoid misdirected redesign efforts and focus corrective action where it will be most effective. Recognizing these indicators …
Cross-sectioning is a fundamental technique in electronic failure analysis used to expose and evaluate the internal construction of devices and assemblies. By physically sectioning a sample and examining its internal features, engineers can directly observe materials, interfaces, and structures that are otherwise inaccessible. Cross-sectioning plays a critical role in identifying manufacturing defects, material degradation, and …
Time Domain Reflectometry (TDR) is a diagnostic technique widely used in electronic failure analysis to evaluate the integrity of conductive paths within devices and assemblies. It is particularly effective for localizing continuity-related defects such as opens, shorts, and impedance discontinuities that are difficult or impossible to detect through visual inspection alone. Because TDR is non-destructive …
Scanning Acoustic Microscopy (SAM) is a non-destructive inspection technique used extensively in electronic failure analysis to detect internal structural defects that are not visible using optical methods. By utilizing high-frequency ultrasonic waves, SAM enables engineers to image subsurface features and interfaces within electronic devices and assemblies, making it particularly valuable for identifying delamination, voids, cracking, …