Common Packaging Materials in Electronic Components — and Why They Matter in Analysis

Why Packaging Materials Matter

The package protects the silicon die, electrical interconnects, and bond structures from mechanical, thermal, and environmental stress. When failures occur, package materials frequently hold the earliest physical evidence of damage.

Organizations such as JEDEC emphasize that package construction and materials must be considered when evaluating device reliability and failure mechanisms

Ignoring packaging materials can lead to incorrect conclusions—particularly when failures are stress-related rather than design-related.

Mold Compounds and Encapsulants

Most plastic-encapsulated components use epoxy-based mold compounds. These materials are engineered for strength, adhesion, and moisture resistance, but they are not immune to degradation.

Common issues associated with mold compounds include:

• Moisture ingress and delamination
• Cracking from thermal cycling
• Filler particle separation or voiding

IPC documentation highlights how moisture sensitivity and mold compound integrity directly affect long-term reliability.

During analysis, surface condition, cracking patterns, and internal separation can help identify whether damage occurred during manufacturing, assembly, or field use.

Lead Frames and Interconnect Materials

Lead frames are typically made from copper alloys or plated copper, chosen for electrical conductivity and mechanical strength. Bond wires, often gold, copper, or aluminum, form the electrical connection between the die and the package leads.

Material-related concerns often include:

• Corrosion or intermetallic formation
• Mechanical fatigue from vibration or thermal stress
• Improper plating or surface finish

The ASM Handbook on electronic materials provides extensive discussion on how interconnect materials behave under stress and aging.

Observing deformation or degradation in these materials can distinguish between process-induced damage and true wear-out mechanisms.

Ceramic and Hermetic Packages

Ceramic and hermetic packages are commonly used in high-reliability or harsh-environment applications. These packages offer superior environmental protection but introduce different failure considerations.

Typical concerns include:

• Seal integrity failures
• Metallization cracking or lift-off
• Thermal expansion mismatch

JEDEC and military-derived standards frequently address these package types due to their use in aerospace and defense systems.

During analysis, ceramic fractures or seal defects often point to mechanical or thermal overstress rather than electrical misuse.

Why Material Identification Supports Better Conclusions

Correctly identifying package materials allows analysts to:

• Correlate physical damage to specific stressors
• Eliminate unlikely failure mechanisms
• Avoid false attribution to silicon-level defects
• Strengthen documentation and reporting

Material awareness also plays a critical role in counterfeit analysis, where mismatched or inconsistent materials may indicate remarking, resurfacing, or substitution.

Using Material Evidence Effectively

Packaging materials do not fail randomly. Their behavior follows known physical and chemical principles. When interpreted correctly, material evidence helps narrow the investigation and supports conclusions that are technically sound and defensible.

Failure analysis is strongest when electrical results and material observations reinforce each other.

Learn more about our Failure Analysis and Engineering Services to see how material evaluation fits into a structured investigation approach.

If you have questions about packaging materials or how they may relate to a specific failure, contact Priority Labs to discuss your analysis needs.