Decapsulation
Decapsulation is a chemical sample preparation technique used to remove the protective package material from electronic devices in order to expose the internal die and associated structures. At Priority Labs, decapsulation is routinely performed on packaged integrated circuits and related devices using a controlled combination of acids, bases, and solvents selected to match the package construction and investigative objective. This process allows direct access to the die surface for visual inspection, imaging, and further analytical evaluation.
The primary purpose of decapsulation is to reveal the die and internal features without mechanically damaging the structures of interest. Mold compounds, epoxies, and encapsulants are designed to protect devices from environmental and mechanical stress, but they also obscure the internal circuitry. Chemical decapsulation selectively removes these materials while preserving the integrity of the die, bond pads, bond wires, and surrounding interfaces.
Decapsulation is commonly performed as part of failure analysis, quality investigations, device authentication, and construction analysis. It enables inspection for defects such as contamination, corrosion, cracking, metallization damage, or manufacturing anomalies that cannot be observed externally. Because the process can be precisely controlled, decapsulation provides a reliable way to expose internal features while maintaining the sample in a condition suitable for subsequent testing or imaging.
Advanced Technical Discussion
At Priority Labs, decapsulation is performed using both manual chemical techniques and automated jet etching systems, depending on the device type, package geometry, and level of control required. Each approach has advantages and is selected based on the specific requirements of the analysis.
Manual decapsulation involves the controlled application of chemical etchants directly to the surface of a device package. Acids are dispensed in a localized manner to dissolve the mold compound covering the die while minimizing exposure to sensitive internal features. Throughout the process, analysts carefully monitor the progression of material removal to avoid over-etching or damage to bond wires, die surfaces, or passivation layers. Once sufficient exposure has been achieved, the device is rinsed with an appropriate solvent to halt the chemical reaction and remove residual etchant. The sample is then dried and prepared for further inspection.
Automated decapsulation is performed using specialized equipment such as a Nisene Technology JetEtch system. Jet etching provides a higher level of repeatability and process control by delivering a focused stream of heated chemical etchant to a precisely defined area of the package. During jet etching, the region targeted for removal is exposed to the etchant, while the remainder of the package surface is protected using a chemically resistant rubber gasket. This selective exposure allows for controlled removal of encapsulant material without affecting adjacent areas of the device.
Jet etching is particularly useful for complex or high-value samples where uniformity and reproducibility are critical. Process parameters such as temperature, flow rate, exposure time, and etchant selection can be adjusted to accommodate different package materials and thicknesses. The ability to precisely control these variables reduces the risk of unintended damage and improves consistency across multiple samples.
Chemical selection is a critical aspect of successful decapsulation. Different mold compounds and package materials respond differently to various acids, bases, and solvents. Priority Labs’ analysts leverage experience with a wide range of package types to select etchants that effectively remove encapsulants while preserving underlying structures. In some cases, multi-step processes are used, combining different chemicals or techniques to achieve optimal results.
Following decapsulation, exposed dies can be examined using optical microscopy, scanning electron microscopy (SEM), or other analytical techniques. Decapsulated samples may also undergo further preparation, such as localized cleaning, surface analysis, or targeted material removal, depending on the goals of the investigation. When necessary, decapsulation results are integrated with findings from electrical testing, X-ray imaging, or cross-sectioning to build a complete understanding of device condition and failure mechanisms.
At Priority Labs, decapsulation is performed as part of a structured analytical workflow rather than as an isolated step. Careful planning ensures that chemical exposure is limited to what is necessary and that the integrity of critical evidence is maintained. This disciplined approach supports reliable interpretation, minimizes artifacts, and enables clear, defensible engineering conclusions.
Through a combination of manual expertise, automated equipment, and material-specific process knowledge, Priority Labs provides decapsulation services that support detailed internal inspection while preserving sample integrity. Whether used for failure investigation, construction analysis, or device evaluation, decapsulation remains an essential technique for accessing the internal features of modern electronic devices.
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